XHFC-1SU/2SU-Soldering

Profiles for soldering reflow of XHFC-1SU and XHFC-2SU

The recommended profiles for soldering reflow of XHFC-1SU / XHFC-2SU for Pb-free assembly as well as Sn-Pb eutectic mainly correspond to the commonly applied JEDEC Standard JSTD-020C. To ensure best surface mounting quality, it is recommended to use the provisions of Pb-free assembly. The soldering profile graph (1.) and table (2.) underneath illustrate the respective soldering reflow.

Surface mount products may have a crack when thermal stress is applied during surface mount assembly if they have absorbed atmospheric moisture. It is recommended that these products are handled under specific conditions.

These conditions are described in the following handling recommendations in table (3.).

 

1. Soldering Profile Graph

Profile for Soldering Reflow

 

2. Soldering Profile Table

Details Soldering Reflow Profile

Profile Feature
Pb-free assembly Sn-Pb eutectic assembly
Average ramp-up rate (TL to TP) 3°C/second max. 3°C/second max.
Preheat
- Temperature Min (TSMIN)
- Temperature Max (TSMAX)
- Time (min to max) (tS)
150°Cc
200°Cc
60-180 secondsc
100°Cc
150°Cc
60-120 secondsc
TSMAX to TL
– Ramp-up Rate
3°C/second max
Time maintained above:
- Temperature (TL)
- Time (tL)
217°Cc
60-150 secondsc
183°Cc
60-150 seconds
Peak Temperature (TP) 260 +0/-5°C 240 +0/-5°C
Time within 5°C of actual Peak Temperature (tP)  20-40 seconds 10-30 seconds
Ramp-down Rate 6°C/second max. 6°C/second max.
Time 25°C to Peak Temperature 8 minutes max. 6 minutes max.

3. Handling recommendations

Handling recommendations

Package Type
Storage Condition
after unpacking
as maximum
Rebake Condition
as minimum
LQFP 64
(Pb-free)
Within 168 hours
(30 °C/60% RH)
MSL 3
125 °C
24 hours